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INTEGRATED CIRCUITS
DATA SHEET
TDA1306T Noise shaping filter DAC
Product specification Supersedes data of September 1994 File under Integrated Circuits, IC01 1998 Jan 06
Philips Semiconductors
Product specification
Noise shaping filter DAC
FEATURES General * Double-speed mode * Digital volume control * Soft mute function * 12 dB attenuation * Low power dissipation * Digital de-emphasis * TDA1305T pin compatible. Easy application * Voltage output * Only 1st-order analog post-filtering required * Operational amplifiers and digital filter integrated * Selectable system clock (fsys) 256fs or 384fs * I2S-bus (fsys = 256fs) or 16, 18 or 20 bits LSB fixed serial input format (fsys = 384fs) * Single rail supply. High performance * Superior signal-to-noise ratio * Wide dynamic range * No zero crossing distortion * Inherently monotonic * Continuous calibration digital-to-analog conversion combined with noise shaping technique. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA1306T SO24 DESCRIPTION GENERAL DESCRIPTION
TDA1306T
The TDA1306T is a dual CMOS digital-to-analog converter with up-sampling filter and noise shaper. The combination of oversampling up to 4fs, noise shaping and continuous calibration conversion ensures that only simple 1st-order analog post-filtering is required. The TDA1306T supports the I2S-bus data input mode (fsys = 256fs) with word lengths of up to 20 bits and the LSB fixed serial data input format (fsys = 384fs) with word lengths of 16, 18 or 20 bits. Two cascaded IIR filters increase the sampling rate 4 times. The DACs are of the continuous calibration type and incorporate a special data coding. This ensures a high signal-to-noise ratio, wide dynamic range and immunity to process variation and component ageing. Two on-board operational amplifiers convert the digital-to-analog current to an output voltage.
VERSION SOT137-1
plastic small outline package; 24 leads; body width 7.5 mm.
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Philips Semiconductors
Product specification
Noise shaping filter DAC
QUICK REFERENCE DATA All power supply pins VDD and VSS must be connected to the same external supply unit. SYMBOL Supply VDDD VDDA VDDO IDDD IDDA IDDO Analog signals VFS(rms) RL (THD + N)/S full-scale output voltage (RMS value) output load resistance VDDD = VDDA = VDDO = 5 V; RL > 5 k 0.935 5 - - - - - - - 6.4 -40 1.1 - -70 0.032 -42 0.8 -108 - - - - digital supply voltage analog supply voltage operational amplifier supply voltage digital supply current analog supply current operational amplifier supply current VDDD = 5 V; at code 00000H VDDA = 5 V; at code 00000H VDDO = 5 V; at code 00000H 4.5 4.5 4.5 - - - 5.0 5.0 5.0 5 3 2 PARAMETER CONDITIONS MIN. TYP.
TDA1306T
MAX.
UNIT
5.5 5.5 5.5 8 5 4
V V V mA mA mA
1.265 - - - -32 2.5 -96 2.822 5.645 18.432 +85
V k
DAC performance total harmonic distortion plus noise-to-signal ratio at 0 dB signal level; fi = 1 kHz; at -60 dB signal level; fi = 1 kHz; S/N BR signal-to-noise ratio input bit rate at data input no signal; A-weighted fs = 44.1 kHz; normal speed fs = 44.1 kHz; double speed fsys Tamb system clock frequency (pin 12) operating ambient temperature dB % dB % dB Mbits/s Mbits/s MHz C
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Philips Semiconductors
Product specification
Noise shaping filter DAC
BLOCK DIAGRAM
TDA1306T
Fig.1 Block diagram.
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Philips Semiconductors
Product specification
Noise shaping filter DAC
PINNING SYMBOL PIN VDDA VSSA TEST1 BCK WS DATA CLKS1 CLKS2 VSSD VDDD TEST2 SYSCLK APP3 APPL APP2 APP1 APP0 VOL FILTCL 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 DESCRIPTION analog supply voltage (+5 V) analog ground test input 1; pin should be connected to ground bit clock input word select input data input clock and format selection 1 input clock and format selection 2 input digital ground digital supply voltage (+5 V) test input 2; pin should be connected to ground system clock input 256fs or 384fs application mode 3 input application mode selection input application mode 2 input application mode 1 input application mode 0 input left channel output capacitor for left channel 1st order filter function; should be connected between pins 19 and 18 capacitor for right channel 1st order filter function; should be connected between pins 20 and 21 right channel output internal reference voltage for output channels; 0.5VDDO (typ.) operational amplifier ground operational amplifier supply voltage
TDA1306T
FILTCR
20
VOR Vref VSSO VDDO
21 22 23 24
Fig.2 Pin configuration.
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Philips Semiconductors
Product specification
Noise shaping filter DAC
FUNCTIONAL DESCRIPTION The TDA1306T CMOS DAC incorporates an up-sampling filter, a noise shaper, continuous calibrated current sources and operational amplifiers. System clock and data input format The TDA1306T accommodates slave mode only. Consequently, in all applications, the system devices must provide the system clock. The system frequency is selectable at pins CLKS1 and CLKS2 (see Table 1). Table 1 Data input format and system clock
TDA1306T
The TDA1306T supports the following data input modes: * I2S-bus with data word length of up to 20 bits (fsys = 256fs) * LSB fixed serial format with data word length of 16, 18 or 20 bits (fsys = 384fs). As this format idles on the MSB it is necessary to know how many bits are being transmitted. The input formats are illustrated in Fig.9. Left and right data channel words are time multiplexed.
SYSTEM CLOCK CLKS1 0 0 1 1 Device operation When the APPL pin is held HIGH and APP3 is held LOW, pins APP0, APP1 and APP2 form a microcontroller interface. When the APPL pin is held LOW, pins APP0, APP1, APP2 and APP3 form a pseudo-static application (TDA1305T pin compatible). PSEUDO-STATIC APPLICATION MODE (APPL = LOGIC 0) In this mode, the device operation is controlled by pseudo-static application pins where: APP0 = attenuation mode control APP1 = double-speed mode control APP2 = mute mode control APP3 = de-emphasis mode control. In the pseudo-static application mode the TDA1306T is pin compatible with the TDA1305T slave mode. The correspondence between TDA1306T pin number, TDA1306T pin name, TDA1305T pin mnemonic and a description of the effects is given in Table 2. CLKS2 0 1 0 1 DATA INPUT FORMAT NORMAL SPEED I2S-bus LSB fixed 16 bits LSB fixed 18 bits LSB fixed 20 bits 256fs 384fs 384fs 384fs DOUBLE SPEED 128fs 192fs 192fs 192fs
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Philips Semiconductors
Product specification
Noise shaping filter DAC
Table 2 Pseudo-static application mode PIN NUMBER 17 TDA1305T FUNCTION ATSB VALUE 0 1 APP1 APP2 APP3 16 15 13 DSMB MUSB DEEM1 0 1 0 1 0 1 MICROCONTROLLER APPLICATION MODE (APPL = LOGIC 1 AND APP3 = LOGIC 0) In this mode, the device operation is controlled by a set of flags in an 8-bit mode control register. The 8-bit mode control register is written by a microcontroller interface where: APPL = logic 1 APP0 = Data APP1 = Clock APP2 = RAB APP3 = logic 0. The correspondence between serial-to-parallel conversion, mode control flags and a summary of the effect of the control flags is given in Table 3. Figures 3 and 4 illustrate the mode set timing.
TDA1306T
PIN MNEMONIC APP0
DESCRIPTION 12 dB attenuation (from full scale) activated (only if MUSB = logic 1) full scale (only if MUSB = logic 1) double-speed mode normal-speed mode samples decrease to mute level level according to ATSB de-emphasis OFF (44.1 kHz) de-emphasis ON (44.1 kHz)
MICROCONTROLLER WRITE OPERATION SEQUENCE The microcontroller write operation follows the following sequence: * APP2 is held LOW by the microcontroller * Microcontroller data is clocked into the internal shift register on the LOW-to-HIGH transition on pin APP1 * Data D7 to D0 is latched into the appropriate control register on the LOW-to-HIGH transition of pin APP2 (APP1 = HIGH) * If more data is clocked into the TDA1306T before the LOW-to-HIGH transition on pin APP2 then only the last 8 bits are used * If less data is clocked into the TDA1306T unpredictable operation will result * If the LOW-to-HIGH transition of pin APP2 occurs when APP1 = LOW, the command will be disregarded.
Fig.3 Microcontroller timing.
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Philips Semiconductors
Product specification
Noise shaping filter DAC
MICROCONTROLLER WRITE OPERATION SEQUENCE (REPEAT
MODE)
TDA1306T
between APP2 pulses. A minimum pause of 22 s is necessary between any two step-up or step-down commands.
The same command can be repeated several times (e.g. for fade function) by applying APP2 pulses as shown in Fig.4. It should be noted that APP1 must stay HIGH
Fig.4 Microcontroller timing (repeat mode).
Table 3
Microcontroller mode control register FUNCTION ATSB DSMB MUSB DEEM FS INCR DECR not applicable DESCRIPTION 12 dB attenuation (from full scale) double speed mute de-emphasis full scale increment decrement reserved ACTIVE LEVEL LOW LOW LOW HIGH HIGH HIGH HIGH not applicable
BIT POSITION D7 D6 D5 D4 D3 D2 D1 D0
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Philips Semiconductors
Product specification
Noise shaping filter DAC
Volume control A digital level control is incorporated in the TDA1306T which performs the function of soft mute and attenuation (pseudo-static application mode) or soft mute, attenuation, fade, increment and decrement (microcontroller application mode). The volume control of both channels can be varied in small step changes determined by the value of the internal fade counter where: Audio level = counter x maximum level/120. Where the counter is a 7-bit binary number between 0 and 120. The time taken for mute to vary from 120 to 0 is 1/120fs. For example, when fs = 44.1 kHz, the time taken is approximately 3 ms.
TDA1306T
VOLUME CONTROL (PSEUDO-STATIC APPLICATION MODE) In the pseudo-static application mode (APPL = logic 0) the digital audio output level is controlled by APP0 (attenuation) and APP2 (mute) so only the final volume levels full scale, 12 dB (attenuate) and mute (-infinity dB) can be selected. The mute function has priority over the attenuation function. Accordingly, if MUSB is LOW, the state of ATSB has no effect. An example of volume control in this application mode is illustrated in Fig.5.
Fig.5 Volume control (pseudo-static application mode).
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Philips Semiconductors
Product specification
Noise shaping filter DAC
VOLUME CONTROL (MICROCONTROLLER APPLICATION MODE) In the microcontroller application mode (APPL = logic 1, APP3 = logic 0) the audio output level is controlled by volume control bits ATSB, MUSB, FS, INCR and DECR. Mute is activated by sending the MUSB command to the mode control register via the microcontroller interface. The audio output level will be reduced to zero in a maximum of 120 steps (depending on the current position of the fade counter) and taking a maximum of 3 ms. Mute, attenuation and full scale are synchronized to prevent operation in the middle of a word. * The counter is preset to 120 by the full scale command * The counter is preset to 30 by the attenuate command when its value is more then 30. If the value of the counter is less than 30 dB the ATSB command has no effect. * The counter is preset to logic 0 by the mute command MUSB * Attenuation (-12 dB) is activated by sending the ATSB command to the fade control register (D7) * Attenuation and mute are cancelled by sending the full-scale command to the fade control register (Register D3).
TDA1306T
To control the fade counter in a continuous way, the INCREMENT and DECREMENT commands are available (fade control Registers D1 and D2). They will increment and decrement the counter by 1 for each register write operation. When issuing more than 1 step-up or step-down command in sequence, the write repeat mode may be used (see microcontroller application mode). An example of volume control in this application mode is illustrated in Fig.6.
(1) INCR and DECR in repeat mode.
Fig.6 Volume control (microcontroller application mode).
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Philips Semiconductors
Product specification
Noise shaping filter DAC
There are two recommended application situations within the microcontroller mode: * The customer wants to use the microcontroller interface without the volume setting facility. In this event the operation is as follows: - Mute ON; by sending the MUSB command - Mute OFF; by sending the FS command - Attenuation ON; by sending the ATSB command - Attenuation OFF; by sending the FS command. It is possible to switch from `Attenuation ON' to `Mute ON' but not vice-versa. * Incorporating the volume control feature operates as follows: - Mute ON; by sending the MUSB command the microcontroller has to store the previous volume setting - Mute OFF; by sending succeeding INCR commands until the previous volume is reached - Attenuation ON; by sending succeeding DECR commands until a relative downstep of -12 dB is reached. The microcontroller has to store the previous volume - Attenuation OFF; by sending the succeeding INCR commands until the previous volume is reached - Volume UP; by sending succeeding INCR commands - Volume DOWN; by sending succeeding DECR commands. De-emphasis A digital de-emphasis is implemented in the TDA1306T. By selecting the DEEM bit at register D4 (microcontroller application mode) or activating the APP3 pin (pseudo-static application mode), de-emphasis can be applied by means of an IIR filter. De-emphasis is synchronized to prevent operation in the middle of a word. Double-speed mode
TDA1306T
The double-speed mode is controlled by the DSMB bit at register D6 (microcontroller application mode) or by activating the APP1 pin (pseudo-static application mode). When the control bit is active LOW the device operates in the double-speed mode. Oversampling filter and noise shaper The digital filter is a four times oversampling filter. It consists of two sections which each increase the sample rate by 2. The noise-shaper operates on 4fs and reduces the in-band noise density. DAC and operational amplifiers In this noise shaping filter DAC a special data code and bidirectional current sources are used in order to achieve true low-noise performance. The special data code guarantees that only small values of current flow to the output during small signal passages while larger positive or negative values are generated using the bidirectional current sources. The noise shaping filter-DAC uses the continuous calibration conversion technique. The operational amplifiers and the internal conversion resistors RCONV1 and RCONV2 convert the DAC current to an output voltage available at VOL and VOR. Connecting an external capacitor between FILTCL and VOL, FILTCR and VOR respectively provides the required 1st-order post filtering.
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Philips Semiconductors
Product specification
Noise shaping filter DAC
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD Txtal Tstg Tamb Ves PARAMETER supply voltage maximum crystal temperature storage temperature operating ambient temperature electrostatic handling note 2 note 3 Notes 1. All VDD and VSS connections must be made to the same power supply. 2. Equivalent to discharging a 100 pF capacitor via a 1.5 k series resistor. 3. Equivalent to discharging a 200 pF capacitor via a 2.5 mH series inductor. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient CONDITIONS in free air VALUE 69 note 1 CONDITIONS - - -65 -40 -2000 -200 MIN.
TDA1306T
MAX. 7.0 +150 +125 +85 +2000 +200 V
UNIT C C C V V
UNIT K/W
QUALITY SPECIFICATION In accordance with "UZW-BO/FQ-0601".
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Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
DC CHARACTERISTICS VDDD = VDDA = VDDO = 5 V; Tamb = 25 C; all voltages referenced to ground (pins 2, 9 and 23); unless otherwise specified. SYMBOL VDDD VDDA VDDO IDDD IDDA IDDO Ptot PARAMETER digital supply voltage (pin 10) analog supply voltage (pin 1) operational amplifier supply voltage (pin 24) digital supply current analog supply current operational amplifier supply current total power dissipation CONDITIONS note 1 note 1 note 1 fsys = 11.28 MHz at digital silence no operational amplifier load resistor fsys = 11.28 MHz; digital silence; no operational amplifier load resistor 4.5 4.5 4.5 - - - - MIN. 5.0 5.0 5.0 5 3 2 50 TYP. MAX. 5.5 5.5 5.5 8 6 4 90 UNIT V V V mA mA mA mW
VIH VIL Rpd |ILI| Ci Vref RCONV VFS(rms) RL Notes
HIGH level digital input voltage (pins 3 to 8 and 11 to 17) LOW level digital input voltage (pins 3 to 8 and 11 to 17) internal pull-down resistor to VSSD (pins 3 and 11) input leakage current input capacitance reference voltage (pin 22) current-to-voltage conversion resistor full-scale output voltage (RMS value) output load resistance RL > 5 k; note 2 with respect to VSSO
0.7VDDD -0.5 17 - - 0.45VDDO 2.4 0.935 5
- - - - - 0.5VDDO 3.0 1.1 -
VDDD + 0.5 V +0.3VDDD 134 10 10 0.55VDDO 3.6 1.265 - V k A pF V k V k
1. All power supply pins (VDD and VSS) must be connected to the same external power supply unit. 2. RL is the AC resistance of the external circuitry connected to the audio outputs of the application circuit.
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Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
AC CHARACTERISTICS (ANALOG) VDDD = VDDA = VDDO = 5 V; Tamb = 25 C; all voltages referenced to ground (pins 2, 9 and 23); unless otherwise specified. SYMBOL DACs SVRR supply voltage ripple rejection VDDA and VDDO unbalance between the 2 DAC voltage outputs (pins 18 and 21) fripple = 1 kHz; Vripple = 100 mV (p-p); C22 = 10 F maximum volume - 40 - dB PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Gv
-
-
0.5
dB
ct
crosstalk between the 2 DAC one output digital silence - voltage outputs the other maximum volume (pins 18 and 21) total harmonic distortion plus noise-to-signal ratio at 0 dB signal level; fi = 1 kHz at -60 dB signal level; fi = 1 kHz - - - - - - fripple = 3 kHz; Vripple = 100 mV (p-p); A-weighted RL > 5 k; fi = 1 kHz; Vo = 2.8 V (p-p) open loop RL > 5 k -
-110
-85
dB
(THD + N)/S
-70 0.032 -42 0.8 -108
- - -32 2.5 -96 - -
dB % dB % dB
S/N
signal-to-noise ratio
no signal; A-weighted
Operational amplifiers Gv PSRR open-loop voltage gain power supply rejection ratio 85 90 dB dB
(THD + N)/S fUG |Zo|
total harmonic distortion plus noise-to-signal ratio unity gain frequency AC output impedance
- - -
-100 4.5 1.5
- - 150
dB MHz
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Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
AC CHARACTERISTICS (DIGITAL) VDDD = VDDA = VDDO 4.5 to 5.5 V; all voltages referenced to ground (pins 2, 9 and 23); Tamb = -40 to +85 C; unless otherwise specified. SYMBOL TWX PARAMETER clock cycle time CONDITIONS fsys = 384fs; normal speed fsys = 192fs; double speed fsys = 256fs; normal speed fsys = 128fs; double speed tCWL tCWH fs fBCK fsys LOW level pulse width fsys HIGH level pulse width word select input audio sample frequency clock input frequency (data input rate) normal speed double speed fsys = 384fs; normal speed; note 1 fsys = 192fs; double speed; note 1 fsys = 256fs; normal speed fsys = 128fs; double speed; note 2 tr tf tH tL tsu th tsuWS thWS tL tH tsuDC thCD tsuCR Notes 1. A clock frequency of up to 96fs is possible in the event of a rising edge of BCK occurring during SYSCLK = LOW. 2. A clock frequency of up to 64fs is possible in the event of a rising edge of BCK occurring during SYSCLK = LOW. rise time fall time bit clock HIGH time bit clock LOW time data set-up time data hold time word select set-up time word select hold time MIN. 54.2 54.2 81.3 81.3 22 22 TYP. 59.1 59.1 88.6 88.6 - - MAX. 104 104 156 156 - - UNIT ns ns ns ns ns ns
Serial input data timing (see Fig.8) 25 50 - - - - - - 55 55 20 10 20 10 44.1 88.2 - - - - - - - - - - - - - - - - - 48 96 64fs 64fs 64fs 48fs 20 20 - - - - - - - - - - - kHz kHz kHz kHz kHz kHz ns ns ns ns ns ns ns ns s s s s s
Microcontroller interface timing (see Fig.9) input LOW time Input HIGH time set-up time DATA to CLOCK hold time CLOCK to DATA set-up time CLOCK to RAB 2 2 1 1 1
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Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
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Fig.7 Data input formats.
Philips Semiconductors
Product specification
Noise shaping filter DAC
TDA1306T
Fig.8 Timing of input signals.
Fig.9 Microcontroller timing.
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Philips Semiconductors
Product specification
Noise shaping filter DAC
TEST AND APPLICATION INFORMATION Filter characteristics Table 4 Digital filter specification (fs = 44.1 kHz) BAND 0 to 19 kHz 19 to 20 kHz 24 kHz 25 to 35 kHz 35 to 64 kHz 64 to 68 kHz 68 kHz 69 to 88 kHz Table 5 ATTENUATION < 0.001 dB < 0.03 dB > 25 dB > 40 dB > 50 dB > 31 dB > 35 dB > 40 dB
TDA1306T
Digital filter phase distortion (fs = 44.1 kHz) BAND PHASE DISTORTION < 1
0 to 16 kHz
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Philips Semiconductors
Product specification
Noise shaping filter DAC
PACKAGE OUTLINE SO24: plastic small outline package; 24 leads; body width 7.5 mm
TDA1306T
SOT137-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 A1 pin 1 index Lp L 1 e bp 12 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 15.6 15.2 0.61 0.60 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT137-1 REFERENCES IEC 075E05 JEDEC MS-013AD EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
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Philips Semiconductors
Product specification
Noise shaping filter DAC
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering
TDA1306T
Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Product specification
Noise shaping filter DAC
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA1306T
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
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Philips Semiconductors
Product specification
Noise shaping filter DAC
NOTES
TDA1306T
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Philips Semiconductors
Product specification
Noise shaping filter DAC
NOTES
TDA1306T
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Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998
Internet: http://www.semiconductors.philips.com
SCA57
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547027/1200/02/pp24
Date of release: 1998 Jan 06
Document order number:
9397 750 03168

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